| PART |
Description |
Maker |
| APA3010F3C-GX |
Tinned pads for improved solderability
|
Kingbright Corporation
|
| MASW-011036-001SMB MASW-011036-14130G MASW-011036- |
Ka-Band High Power Terminated SPDT PIN Switch
Die with G-S-G RF Pads and DC Bias Pads
|
M/A-COM Technology Solu...
|
| VXC1-1133-26M5625000 |
7 x 5 x 1.7mm 4 pads
|
Vectron International, Inc
|
| 510-110 |
Perm-O-Pads - TO-5 Mounts
|
Bivar, Inc.
|
| GF576 |
SMD CMOS output 6 pads
|
Mercury United Electron...
|
| GW576 |
SMD CMOS output 6 pads
|
Mercury United Electron...
|
| JXXAA1 JXXAA3 JXXBB1 JXXAB1 JSBA3 JSBB3 JSBB1 J16A |
5mm X 3.2mm X 4 Pads Ceramic Package
|
MMD Components
|
| VXC4-1034R VXC4-1034R-25M000 |
7 x 5 x 1.1 mm 4 pads ± 50 PPM at -20C to 70C 30 Ohms Maximum at 100 uW
7 x 5 x 1.1 mm 4 pads 【 50 PPM at -20C to 70C 30 Ohms Maximum at 100 uW
|
VITESSE[Vitesse Semiconductor Corporation]
|
| A2C25-A-C8 MACC25-A-C MACC25-AV-D |
Hold cords, cables, and tubing Two rubber adhesive pads for added strength
|
PANDUIT CORP.
|
| DG407 |
Improved, Dual 8 Channel CMOS Analog Multiplexers(改进型双8通道CMOS模拟多路复用
Improved, Dual 8 Channel CMOS Analog Multiplexers(?硅????8???CMOS妯℃?澶?矾澶????
|
Maxim Integrated Products, Inc.
|
